Parameter

Description

 Basic materials

 FR2, FR3, FR4, FR-5,CEM1, CEM3,  polyimid.  Other  materials available on request

 Layers

 up to 22 layers

 Maximum board  size

 480 x 580 mm, special: 584.2 x 1041.4 mm

 Minimum board thickness

 0,1 mm

 Maximum board thickness

 3,2 mm, special : 6,50 mm

 Copper thickness

18 µm, 36 µm, special : 9 µm, 72 µm, 144 µm, 210 µm up to 350 µm

 Minimum drill size

 0,2 mm

 Minimum track width

 100 µm

 Minimum track space

 100 µm

Board contours

 scored, routed

 Surface finish

 HASL, Immersion Nickel / Gold, Galvanic  Nickel / Gold , Carbon ink, Silver ink

 Solder mask type

 Dry Film Mask,  Liquid Photo-Imageable Mask, Peelable Solder Mask. All Masks available in all common colours

 Notation print

 Available in all common colours

 Applications

 Bonding, SMT

 Flammability

94V0

LAY –UP STRUCTURE (sample)