Innovative copper foil products
Gould Electronics Inc.
introduce four innovative copper foil products to meet the needs
of the printed circuit board industry. They are TCR(TM) foil with integrated thin film resistor, TCU(TM) ultra-thin copper
planar capacitor foil and LD(TM) foil for laser drilling.
These specialty foils will help PCB fabricators
and laminators improve productivity, increase yields, lower costs
and reduce labor. They are available in a wide variety of widths
and thicknesses to meet most any requirement our customers have
in the manufacture of advanced printed circuit boards.
TCR thin film resistor
foil was developed to meet the increasing challenges of packaging
high speed, high density electronic devices. TCR foil provides minimal
resistance variation, predictability for product consistency, better
resistor tolerances, reduced fabrication steps and excellent thermal
stability. This new product consists of a resistive metal, which
is applied to the matte side of Grade 3 RTC(TM) reverse treat copper
foil using roll-to-roll vacuum deposition techniques. The resistive
material is also available on other base foils.
TCU ultra thin copper
foil was created for HDI and high speed circuit boards. Its very
low profile structure makes it ideal for applications involving
controlled impedance, high frequencies and very fine lines. TCU
is a copper carrier foil with a thin copper layer applied using
proprietary technology. The copper carrier provides handleability,
higher lamination yields and protection before photoresist processing.
Unlike other products on the market today, the carrier can be easily
removed, even after exposure to temperatures as high as 225 degrees
TCC planar capacitor
foil was developed in response to the need for increased function,
speed and high density packaging in printed circuits. It consists
of a polymeric substrate with a thin metal tiecoat, copper seedcoat
and a layer of electrodeposited copper on both sides. TCC eliminates
the design and handling challenges posed by other embedded capacitor
technologies. The polyimide dielectric is free standing and non-brittle
so designers need not be concerned about overlapping etched features
and copper on card edge. Its smooth metal-to-dielectric interface
and precise thickness tolerance ensures dielectric integrity is
LD laser drillable
foil is intended for high density circuitry with small micro via
interconnects in advanced printed wiring boards. It allows manufacturers
using CO2 laser drills to lase less than 100 micron diameter microvias
at reduced power thereby avoiding the issues of copper overhang
and resin crack defects associated with conventional foils. Cycle
times are dramatically shortened by eliminating conventional conformal
mask process steps for CO2 lasers. LD foil is manufactured by applying
a micro thin, nickel-based surface treatment to copper foil in a
proprietary process. The finished product is a foil with a low reflectivity,
energy absorbing surface treatment.
For more information please visit: http://www.gould.com.