Parameter

Description

 Base materials

 FR1, FR2, FR3, FR4, CEM1, CEM3. Other  materials available on request

 Maximum board size

 490 x 590mm, special: 584.2 x 1041.4 mm

 Minimum board thickness

 0,1 mm, special: 0,075 mm

 Maximum board thickness

 3,2 mm, special: 6,50 mm

 Minimum drill size

 0,2 mm

 Minimum track width

 100 µm

 Minimum track space

 100 µm

 contours

 scored, routed, punched

 Surface finish

 Bare copper, Entek or Flux coating , HASL, Immersion Nickel / Gold, Galvanic  Nickel / Gold , Carbon ink, Silver ink

 Solder mask type

Dry Film Mask,  Liquid Photo-Imageable Mask, Peelable Solder Mask. All Masks available in all common colours

 Notation print   

 Available in all common colours

 Application

 Bonding, SMT

 Others

 Flammability: 94VO