| Process |
Data |
Description |
| A.Basic Material |
Base Materials (ROHS compatible) |
FR1, FR2, CEM1, CEM3, FR4, high Tg FR-4, high CTI FR-4, anti CAF FR-4, FR-4 halogen free, Teflon & ceramic HF materials (Rogers, Isola, Taconic, Arlon, Shengyi, TUC, Wangling), Polyimide for flex und Starr-flex (DuPont, Panasonic, ThinFlex) |
| Base copper thickness, µm |
9, 12, 18, 35, 70, 105 µm (higher up to 420 µm possible to achieve, also by plating) |
| Thickness capability, mm |
0.10 ~ 3.20 |
| Special, mm |
0.05 ~ 12.00 |
| B.Board/ Lamination |
1. Multi-layer alignment precision, mm |
± 0.050 |
 |
| 2. Min. laminated Board thickness, mm |
0.200 |
| Special, mm |
0.075 |
| 3.Board dimension max, mm |
480 x 780 |
| Special - up to, mm |
610 x 1200 (rigid), 406 x 737 (flex) |
| C.Drilling |
1.Maximum drill size, mm |
6.50 |
 |
| 2.Minimum mech. drill size, mm |
0.100 |
| Special, mm |
0,075 |
| 3.Minimum Laser drill size, mm |
0.100 |
| 4.Hole position tolerance, mm |
± 0.025 |
| 5.Hole size tolerance, mm |
± 0.076 |
| Special, mm |
± 0.050 |
| D.Dry film |
1.Minimum line width (1/2 oz base copper), mm |
0.100 |
 |
| Special: |
|
| 1/2 oz base copper, mm |
0.075 |
| 1/3 oz base copper, mm |
0.050 |
| 2.Minimum line width (1 oz base copper), mm |
0.127 |
| Special, mm |
0.100 |
| 3.Minimum spacing (line to line, 1/2 oz base copper). mm |
0.100 |
| Special: |
|
| 1/2 oz base copper, mm |
0.075 |
| 1/3 oz base copper, mm |
0.038 (inner layers) |
| 4.Minimum spacing (Line to line, 1 oz base copper), mm |
0.127 |
| Special, mm: |
0.100 |
| 5.Minimum spacing (Pad to pad , 1/2 oz base copper), mm |
0.100 |
| 6.Minimum spacing (Pad to pad, 1 oz base copper), mm |
0.127 |
| 7.Minimum spacing (line to pad), mm |
0.100 |
| 8.Minimum bonding lead width 1/2 oz base copper, mm |
0.120 |
| 9.Minimum bonding lead width (1 oz base copper) |
0.150 |
| 10.Minimum spacing between bonding lead |
0.100 |
| 11.Minimum annular ring |
0.100 |
| 12.Front/Back alignment |
± 0.050 |
| 13.Minimum spacing between line and PTH hole |
0.125 |
| E.Plating |
1. Min. average copper thickness in hole, µm |
20 ~ 30 |
 |
| 2.Nickel plating thickness, µm |
2 ~ 11 |
| 3. Gold plating thickness (immersion gold), µm |
0.025 ~ 0.250 |
| 4.Finished hole size tolerance, mm |
± 0.076 |
| 5.Finished hole size tolerance for press-fit, mm |
± 0.050 |
| F.Etching |
1. Finished line width deviation (1 oz base copper HAL board), % |
10 |
 |
| 2.Finished spacing deviation (1 oz base copper HAL board), % |
20 |
| 3.Total track width under cut (1/2 oz base copper), % |
10 |
| 4.Total track width under cut (1 oz base copper), % |
20 |
| G.Solder Mask |
1.Minimum solder mask clearance, mm |
0.050 |
 |
| 2.Minimum solder mask line coverage, mm |
0.075 |
| 3.Minimum solder mask bridge, mm |
0.100 |
| H.Legend |
1.Minimum marking width, mm |
0.150 |
 |
| 2.Minimum marking to hole spacing (Marking in hole is not allowed), mm |
0.200 |
| 3.Minimum marking to pad spacing (Marking on pad is not allowed), mm |
0.200 |
| I.Carbon ink |
1.Minimum spacing between two carbon line, mm |
0.200 |
|
| 2.Minimum carbon line width, mm |
0.200 |
| J.2nd Drill |
1.True position tolerance, mm |
± 0.076 |
|
| K.Routing |
1.Outline dimension tolerance, mm |
± 0.100 |
 |
| 2.Outline to drill hole position tolerance, mm |
± 0.050 |
| 3.Outline to conductor position tolerance, mm |
± 0.050 |
| 4.Minimum outline to conductor, mm |
0.100 |
| 5.Minimum outline to drill hole spacing, mm |
0.100 |
| L.Punching |
1.Outline dimension tolerance, mm |
± 0.100 |
 |
| 2.Outline to drill hole position tolerance, mm |
± 0.05 |
| 3.Outline to punch hole position tolerance, mm |
±0.050 |
| 4.Outline to conductor position tolerance, mm |
± 0.050 |
| 5.Minimum outline to conductor spacing, mm |
0.200 |
| 6.Minimum outline to hole spacing, mm |
same as PCB thickness |
| 7.Punch hole true position tolerance, mm |
± 0.100 |
| 8.Punch hole size tolerance, mm |
minus 0.05 / plus 0.100 |
| 9.Minimum punch hole size, mm |
0.700 |
| M.V-cut |
1.Front/Back alignment tolerance, mm |
±0.100 |
 |
| 2.Minimum spacing between V-score and conductor, mm |
0.200 |
| 3.Remained thickness tolerance, mm |
±0.050 |
| 4.V-score to V-score tolerance, mm |
±0.100 |
| 5.V-score to outline tolerance, mm |
±0.100 |
| 6. V-score angle tolerance, degree |
±3 |
| 7. possible v-cut angles, degree |
30 , 45 |
| N.Chamfer |
1.Chamfer depth tolerance, mm |
±0.100 |
 |
| 2.Chamfer remained thickness tolerance, mm |
±0.100 |
| O. Surface Finish |
OSP, HASL SnPb, lead free HASL (ROHS), immersion Nickel / Gold (ENIG), galvanic Nickel / hard Gold , bondable soft Gold, ENEPIG, immersion Tin, immersion Silver, Carbon Print |
| P. Solder mask |
Liquid Photoimageable Mask, peelable Mask, Dry Film Mask. Mask colours: green, white, black, blue, red, yellow and violet (all: matt or glossy). |
| R. Notation print |
In white, black or yellow colour |
| S. Further details |
IPC-A-600H class 2 or 3, Fixture or Flying Probe E-test, AOI for all layers of multilayer boards.. HDI Design, Via plugging by mask, filling with resin (also thermal or electric conductive). Half hole – edge plating, blind & buried VIAs and stacked VIAs, Laser Micro VIAs, Via-in-Pad Technology, asymmetric stack-up, hybrid stack-up (e.g. FR-4 + Rogers), Impedance control, incl. measuring with standard (± 10%) and advanced (down to ± 5%) tolerance, with Test Coupon, cross section Sample or Photo. |
