Process |
Data |
Description |
A.Board/ Lamination |
1.Multi-layer alignment precision
|
± 0.050mm |
|
2.Minimum laminated Board thickness
special: |
0.200 mm
0.075 mm |
3.Board dimension max:
special - up to: |
490 x 590 mm
584.2 x 1014.4 mm
|
B.Basic Material |
2.Thickness capability
special: |
0.100mm~ 3.200mm
0.050 - 6.40 mm |
|
3.Thickness capability (incl.HAL)
special: |
0.230mm~
3.230mm
0.075 mm - 6.50 mm
|
C.Drilling |
1.Maximum drill size |
6.500 mm |
|
2.Minimum mech. drill size |
0.200mm |
3.Minimum Laser drill size |
0.100mm |
4.Hole size tolerance |
± 0.025 mm |
5.Hole position tolerance |
± 0.076 mm |
D.Dry film |
1.Minimum line width (1/2 oz base
copper)
special:
|
0.100 mm
0.075 mm |
|
2.Minimum line width (1 oz base copper)
special: |
0.127 mm
0.100 mm |
3.Minimum spacing (Line to line, 1/2
oz base copper)
special: |
0.100 mm
0.075 mm |
4.Minimum spacing (Line to line, 1
oz base copper)
special: |
0.127 mm
0.100 mm |
Process |
Data |
|
D.Dry film |
5.Minimum spacing (Pad to pad , 1/2
oz base copper) |
0.100 mm |
Click here. |
6.Minimum spacing (Pad to pad, 1 oz
base copper) |
0.127mm |
7.Minimum spacing (line to pad) |
0.100 mm |
8.Minimum bonding lead width 1/2 oz
base copper |
0.120 mm |
9.Minimum bonding lead width (1 oz
base copper) |
0.150 mm |
10.Minimum spacing between bonding
lead |
0.100 mm |
11.Minimum annular ring |
0.100 mm |
12.Front/Back alignment |
± 0.050 mm |
13.Minimum spacing between line to
NPTH hole |
0.200 mm |
E.Plating |
1.Copper thickness in hole (Per customer
requirement) |
20 µm |
|
2.Copper thickness in hole (Gold plating
board) |
20 µm |
3.Nickel plating thickness |
2.500~5 µm |
4.Gold plating thickness (immersion
gold) |
0.0076 µm~ 0.2286 µm |
5.Finished hole size tolerance |
± 0.076 mm |
Process |
Data |
|
F.Etching
|
1.Finished line width deviation (1
oz base copper HAL board) |
± 10% |
|
2.Finished spacing deviation (1 oz
base copper HAL board) |
± 20% |
3.Total under cut (1/2 oz base
copper) |
track width–10% |
4.Total under cut (1 oz base
copper) |
track width–20% |
G.Solder
Mask |
1.Minimum solder mask clearance |
0.050 mm
|
|
2.Minimum solder mask line coverage
|
0.075 mm
|
3.Minimum solder mask bridge |
0.100 mm |
H.Legend |
1.Minimum marking width |
0.150 mm |
 |
2.Minimum marking to hole spacing
(Marking in hole is not allowed) |
0.200 mm |
3.Minimum marking to pad spacing (Marking
on pad is not allowed) |
0.200 mm |
I.Carbon
ink |
1.Minimum spacing between two carbon
line |
0.200 mm |
|
2.Minimum carbon line width |
0.200 mm |
J.2nd Drill |
1.True position tolerance |
± 0.076 mm |
|
K.Routing |
1.Outline dimension tolerance |
± 0.100 mm |
|
2.Outline to drill hole position tolerance |
± 0.050 mm |
3.Outline to conductor position tolerance |
± 0.050 mm |
4.Minimum outline to conductor |
0.100 mm |
5.Minimum outline to drill hole spacing |
0.100 mm |
Process |
Data
|
|
L.Punching |
1.Outline dimension tolerance |
± 0.100 mm |
|
2.Outline to drill hole position tolerance |
± 0.05 mm |
3.Outline to punch hole position tolerance |
±0.050 mm |
4.Outline to conductor position tolerance |
± 0.050 mm |
5.Minimum outline to conductor spacing |
0.200 mm |
6.Minimum outline to hole spacing |
same as PCB thickness |
7.Punch hole true position tolerance |
± 0.100 mm |
8.Punch hole size tolerance |
+0.050/
-0.100 mm |
9.Minimum punch hole size |
0.700 mm |
M.V-cut |
1.Front/Back alignment tolerance |
±0.100 mm |
|
2.Minimum spacing between V-score
and conductor |
0.200mm |
3.Remained thickness tolerance |
±0.050 mm |
4.V-score to V-score tolerance |
±0.100 mm |
5.V-score to outline tolerance |
±0.100 mm |
6. V-score angle tolerance |
±3° |
7. possible v-cut angles |
30, 45 degree |
N.Chamfer
|
1.Chamfer depth tolerance
|
±0.100 mm
|
|
2.Chamfer remained thickness tolerance |
±0.100 mm |
