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Technical Abilities

You can see here our General manufacturing capability for single, double sided and multilayerprinted circuit boards.Where tighter tolerances are required from your side, please contact us,and we will for sure find a good solution for your requirement.


 

 

 

Process Data Description
A.Basic Material Base Materials (ROHS compatible) FR1, FR2, CEM1, CEM3, FR4, high Tg FR-4, high CTI FR-4, anti CAF FR-4, FR-4 halogen free, Teflon & ceramic HF materials (Rogers, Isola, Taconic, Arlon, Shengyi, TUC, Wangling), Polyimide for flex und Starr-flex (DuPont, Panasonic, ThinFlex)
Base copper thickness, m 9, 12, 18, 35, 70, 105 m (higher up to 420 m possible to achieve, also by plating)
Thickness capability, mm 0.10 ~ 3.20
Special, mm 0.05 ~ 12.00
B.Board/ Lamination 1. Multi-layer alignment precision, mm 0.050
2. Min. laminated Board thickness, mm 0.200
Special, mm 0.075
3.Board dimension max, mm 480 x 780
Special - up to, mm 610 x 1200 (rigid), 406 x 737 (flex)
C.Drilling 1.Maximum drill size, mm 6.50
2.Minimum mech. drill size, mm 0.100
Special, mm 0,075
3.Minimum Laser drill size, mm 0.100
4.Hole position tolerance, mm 0.025
5.Hole size tolerance, mm 0.076
Special, mm 0.050
D.Dry film 1.Minimum line width (1/2 oz base copper), mm 0.100


Special:
1/2 oz base copper, mm 0.075
1/3 oz base copper, mm 0.050
2.Minimum line width (1 oz base copper), mm 0.127
Special, mm 0.100
3.Minimum spacing (line to line, 1/2 oz base copper). mm 0.100
Special:
1/2 oz base copper, mm 0.075
1/3 oz base copper, mm 0.038 (inner layers)
4.Minimum spacing (Line to line, 1 oz base copper), mm 0.127
Special, mm: 0.100
5.Minimum spacing (Pad to pad , 1/2 oz base copper), mm 0.100
6.Minimum spacing (Pad to pad, 1 oz base copper), mm 0.127
7.Minimum spacing (line to pad), mm 0.100
8.Minimum bonding lead width 1/2 oz base copper, mm 0.120
9.Minimum bonding lead width (1 oz base copper) 0.150
10.Minimum spacing between bonding lead 0.100
11.Minimum annular ring 0.100
12.Front/Back alignment 0.050
13.Minimum spacing between line and PTH hole 0.125
E.Plating 1. Min. average copper thickness in hole, m 20 ~ 30
2.Nickel plating thickness, m 2 ~ 11
3. Gold plating thickness (immersion gold), m 0.025 ~ 0.250
4.Finished hole size tolerance, mm 0.076
5.Finished hole size tolerance for press-fit, mm 0.050
F.Etching 1. Finished line width deviation (1 oz base copper HAL board), % 10
2.Finished spacing deviation (1 oz base copper HAL board), % 20
3.Total track width under cut (1/2 oz base copper), % 10
4.Total track width under cut (1 oz base copper), % 20
G.Solder Mask 1.Minimum solder mask clearance, mm 0.050
2.Minimum solder mask line coverage, mm 0.075
3.Minimum solder mask bridge, mm 0.100
H.Legend 1.Minimum marking width, mm 0.150
2.Minimum marking to hole spacing (Marking in hole is not allowed), mm 0.200
3.Minimum marking to pad spacing (Marking on pad is not allowed), mm 0.200
I.Carbon ink 1.Minimum spacing between two carbon line, mm 0.200
2.Minimum carbon line width, mm 0.200
J.2nd Drill 1.True position tolerance, mm 0.076
K.Routing 1.Outline dimension tolerance, mm 0.100
2.Outline to drill hole position tolerance, mm 0.050
3.Outline to conductor position tolerance, mm 0.050
4.Minimum outline to conductor, mm 0.100
5.Minimum outline to drill hole spacing, mm 0.100
L.Punching 1.Outline dimension tolerance, mm 0.100
2.Outline to drill hole position tolerance, mm 0.05
3.Outline to punch hole position tolerance, mm 0.050
4.Outline to conductor position tolerance, mm 0.050
5.Minimum outline to conductor spacing, mm 0.200
6.Minimum outline to hole spacing, mm same as PCB thickness
7.Punch hole true position tolerance, mm 0.100
8.Punch hole size tolerance, mm minus 0.05 / plus 0.100
9.Minimum punch hole size, mm 0.700
M.V-cut 1.Front/Back alignment tolerance, mm 0.100
2.Minimum spacing between V-score and conductor, mm 0.200
3.Remained thickness tolerance, mm 0.050
4.V-score to V-score tolerance, mm 0.100
5.V-score to outline tolerance, mm 0.100
6. V-score angle tolerance, degree 3
7. possible v-cut angles, degree 30 , 45
N.Chamfer 1.Chamfer depth tolerance, mm 0.100
2.Chamfer remained thickness tolerance, mm 0.100
O. Surface Finish OSP, HASL SnPb, lead free HASL (ROHS), immersion Nickel / Gold (ENIG), galvanic Nickel / hard Gold , bondable soft Gold, ENEPIG, immersion Tin, immersion Silver, Carbon Print
P. Solder mask Liquid Photoimageable Mask, peelable Mask, Dry Film Mask. Mask colours: green, white, black, blue, red, yellow and violet (all: matt or glossy).
R. Notation print In white, black or yellow colour
S. Further details IPC-A-600H class 2 or 3, Fixture or Flying Probe E-test, AOI for all layers of multilayer boards.. HDI Design, Via plugging by mask, filling with resin (also thermal or electric conductive). Half hole edge plating, blind & buried VIAs and stacked VIAs, Laser Micro VIAs, Via-in-Pad Technology, asymmetric stack-up, hybrid stack-up (e.g. FR-4 + Rogers), Impedance control, incl. measuring with standard ( 10%) and advanced (down to 5%) tolerance, with Test Coupon, cross section Sample or Photo.

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