Process	Data		Description
A.Board/ Lamination	1.Multi-layer alignment precision	± 0.050mm
	2.Minimum laminated Board thickness special:	0.200 mm 0.075 mm
	3.Board dimension max: special - up to:	490 x 590 mm 584.2 x 1014.4 mm
B.Basic Material	2.Thickness capability special:	0.100mm~ 3.200mm 0.050 - 6.40 mm
	3.Thickness capability (incl.HAL) special:	0.230mm~ 3.230mm   0.075 mm - 6.50 mm
C.Drilling	1.Maximum drill size	6.500 mm
	2.Minimum mech. drill size	0.200mm
	3.Minimum Laser drill size	0.100mm
	4.Hole size tolerance	± 0.025 mm
	5.Hole position tolerance	± 0.076 mm
D.Dry film	1.Minimum line width (1/2 oz base copper) special:	0.100 mm 0.075 mm
	2.Minimum line width (1 oz base copper) special:	0.127 mm 0.100 mm
	3.Minimum spacing (Line to line, 1/2 oz base copper) special:	0.100 mm   0.075 mm
	4.Minimum spacing (Line to line, 1 oz base copper) special:	0.127 mm 0.100 mm
Process	Data
D.Dry film	5.Minimum spacing (Pad to pad , 1/2 oz base copper)	0.100 mm	Click here.
	6.Minimum spacing (Pad to pad, 1 oz base copper)	0.127mm
	7.Minimum spacing (line to pad)	0.100 mm
	8.Minimum bonding lead width 1/2 oz base copper	0.120 mm
	9.Minimum bonding lead width (1 oz base copper)	0.150 mm
	10.Minimum spacing between bonding lead	0.100 mm
	11.Minimum annular ring	0.100 mm
	12.Front/Back alignment	± 0.050 mm
	13.Minimum spacing between line to NPTH hole	0.200 mm
E.Plating	1.Copper thickness in hole (Per customer requirement)	20 µm
	2.Copper thickness in hole (Gold plating board)	20 µm
	3.Nickel plating thickness	2.500~5 µm
	4.Gold plating thickness  (immersion gold)	0.0076 µm~ 0.2286 µm
	5.Finished hole size tolerance	± 0.076 mm
Process	Data
F.Etching	1.Finished line width deviation (1 oz base copper HAL board)	± 10%
	2.Finished spacing deviation (1 oz base copper HAL board)	± 20%
	3.Total under cut  (1/2 oz base copper)	track width–10%
	4.Total under cut  (1 oz base copper)	track width–20%
G.Solder  Mask	1.Minimum solder mask clearance	0.050 mm
	2.Minimum solder mask line coverage	0.075 mm
	3.Minimum solder mask bridge	0.100 mm
H.Legend	1.Minimum marking width	0.150 mm
	2.Minimum marking to hole spacing (Marking in hole is not allowed)	0.200 mm
	3.Minimum marking to pad spacing (Marking on pad is not allowed)	0.200 mm
I.Carbon ink	1.Minimum spacing between two carbon line	0.200 mm
	2.Minimum carbon line width	0.200 mm
J.2nd Drill	1.True position tolerance	± 0.076 mm
K.Routing	1.Outline dimension tolerance	± 0.100 mm
	2.Outline to drill hole position tolerance	± 0.050 mm
	3.Outline to conductor position tolerance	± 0.050 mm
	4.Minimum outline to conductor	0.100 mm
	5.Minimum outline to drill hole spacing	0.100 mm
Process	Data
L.Punching	1.Outline dimension tolerance	± 0.100 mm
	2.Outline to drill hole position tolerance	± 0.05 mm
	3.Outline to punch hole position tolerance	±0.050 mm
	4.Outline to conductor position tolerance	± 0.050 mm
	5.Minimum outline to conductor spacing	0.200 mm
	6.Minimum outline to hole spacing	same as PCB thickness
	7.Punch hole true position tolerance	± 0.100 mm
	8.Punch hole size tolerance	+0.050/ -0.100 mm
	9.Minimum punch hole size	0.700 mm
M.V-cut	1.Front/Back alignment tolerance	±0.100 mm
	2.Minimum spacing between V-score and conductor	0.200mm
	3.Remained thickness tolerance	±0.050 mm
	4.V-score to V-score tolerance	±0.100 mm
	5.V-score to outline tolerance	±0.100 mm
	6. V-score angle tolerance	±3°
	7. possible v-cut angles	30, 45 degree
N.Chamfer	1.Chamfer depth tolerance	±0.100 mm
	2.Chamfer remained thickness tolerance	±0.100 mm

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